Cuivre , cible sputtering, diamètre x épaisseur 2,00 po x 0,25 po , base des métaux traces 99,95 %

Code: 767476-1ea D2-231

Non disponible en dehors du Royaume-Uni et de l'Irlande

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturizatio...


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Votre prix
$282.90 EACH
DEMANDER

Non disponible en dehors du Royaume-Uni et de l'Irlande

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

Packaging

1 ea in rigid mailer

assay99.95% trace metals basis
bp2567 °C (lit.)
density8.94 g/mL at 25 °C (lit.)
diam. × thickness2.00 in. × 0.25 in.
formturnings
InChI keyRYGMFSIKBFXOCR-UHFFFAOYSA-N
InChI1S/Cu
mp1083.4 °C (lit.)
Quality Level100
reaction suitabilitycore: copper
resistivity1.673 µΩ-cm, 20°C
SMILES string[Cu]
Cas Number7440-50-8
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