Non disponible en dehors du Royaume-Uni et de l'Irlande

Features and Benefits

Deposits have low internal stress and are very ductile. Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity. As plated Ni films have small grains in the range of 10 - 50 nm. Grain size orientations are (111) and (200) for FCC (face centred cubic). Qualified bath metrology for replenishment and a long shelf life.Electroplated Ni film (5-10 µm thickness) properties: Density: 8.1 g/cm³ Young′s modulus: 210 GPa Internal stress 33 ± 13 MPa Tensile strength: 585 ± 40 MPa Grain size: 10-50 nm

General description

Nickel electroplating solution is designed for the fabrication of low stress, smooth and pinhole-free nickel films.