Non disponible en dehors du Royaume-Uni et de l'Irlande
Application
It is ideal for spray etching of copper. Ferric chloride based Cu etchant with etch rate of 0.5 mil/min @ 40 °C.
CE-200 solution can be used to etch out the copper residue or foil from the chemical vapor deposited (CVD) graphene or carbonated films by immersing the substrate with the nanomaterial into the etchant solution for 30 min.
Packaging
500 mL in glass bottle
Ce produit répond aux critères suivants: