Silicon , sputtering target, diam. x thickness 2.00 in. x 0.25 in., 99.999% trace metals basis

Code: 767492-1ea D2-231

Not available outside of the UK & Ireland.

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturizatio...


read more

Your Price
$437.20 EACH
REQUEST

Not available outside of the UK & Ireland.

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition

Packaging

1 ea in rigid mailer

assay99.999% trace metals basis
bp2355 °C (lit.)
density2.33 g/mL at 25 °C (lit.)
diam. × thickness2.00 in. × 0.25 in.
formsolid
InChI keyXUIMIQQOPSSXEZ-UHFFFAOYSA-N
InChI1S/Si
mp1410 °C (lit.)
Quality Level100
reaction suitabilitycore: silicon
SMILES string[Si]
Cas Number7440-21-3
This product has met the following criteria: