Not available outside of the UK & Ireland.

Application

This ink was tested on polyimide and silicon dioxide substrates.

General description

Curing condition: 250-350 °C, 20-30 min.

Hexagonal boron nitride ink (hBN) is an insulating material with properties like high thermal conductivity, excellent dimensional stability, and good mechanical robustness. hBN inks can be used in the fabrication of flexible memory devices.

Legal Information

Sold under Materials Transfer Agreement with Mark Hersam group at Northwestern University.